Company  ACQUTEK Semiconductor & Technology Co., Ltd. CEO  Byung Keun, Han / Chan Hong, Park YEAR OF FOUNDATION  1979 No. OF EMPLOYEE  202 Homepage  www.acqutek.co.kr/eng/index.asp Address   493-3 sungsung-dong Cheonan City Choongnam-do, Korea Listed  KOSDAQ CONTACT Person Name E-Mail master@acqutek.co.kr Dept Tel 82-41-559-0600 Title Fax FINANCIAL STATUS(2005) Capital(US$) Sales Revenue(US$) Exporting Amount(US$) 16,094,000 24,204,000 FINANCIAL STATUS(2006) Capital(US$) Sales Revenue(US$) Exporting Amount(US$) Main Business Field  IT Main Products Product1 Product Name LF(Leadframe) Description Leadframe is one of the major part of conventional chip package together with a chip die, mold compounds and gold wire. Leadframe loads chip on its pad to form the shape of package and also acts as a conductor transferring electrical signals between chip and board and as a heat generator. So high confidence and accuracy is required to leadframe in the course of manufacturing process to satisfy its electrical and physical characteristics. Applicable Area Overseas Sales Product2 Product Name COF(“Chip On Film” or “Chip On Flex circuit&rdquo Description This is a new method of chip packaging method that can be made with more thin film than what is applied to TCP (Tape Carrier Package) so COF can be formed as a fine pitch circuit patterns on film. Applicable Area COF is a new type chip package on which IC chip is directly mounted to the surface of flex circuit so that its packaging process is very simple compared with conventional package and due to its high flexibility, the package can be fold or rolled or vent. This advantage can make COF to be applied to a very small electronic appliance like a multi function cell phone or LDI(LCD Driver IC) for high quality plat display adopted to PDP, TFT-LCD, OLED or others which has many electronic signal path on gate or source connector. COF also has wide application area where needed high density with flexibility. Overseas Sales MAJOR PARTNER /CUSTOMER