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¾øÀ½ |
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2009/12/03 |
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3704 |
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Company |
FROM30 Co.,Ltd |
CEO |
Kwang Bin, Lim |
YEAR
OF FOUNDATION |
1998 |
No. OF
EMPLOYEE |
98 |
Homepage |
www.from30.co.kr/eng_index.html |
Address |
FROM30 Co.,Ltd 401-58 Cheonggye-ri Dongtan-myeon, Hwaseong-si Gyeonggi-do, Korea |
Listed |
KOSDAQ |
CONTACT
Person |
Name |
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E-Mail |
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marketing@from30.co.kr |
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Dept |
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Sales Part |
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Tel |
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82-31-371-5800 |
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Title |
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Fax |
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82-31-378-5760 |
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FINANCIAL
STATUS(2005) |
Capital(US$) |
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Sales Revenue(US$) |
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Exporting Amount(US$) |
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1,877,000 |
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42,235,000 |
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FINANCIAL
STATUS(2006) |
Capital(US$) |
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Sales Revenue(US$) |
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Exporting Amount(US$) |
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Main Business Field |
IT |
Main
Products |
Product1 |
Product Name |
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WBI (Wafer Burn-IN System) |
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Description |
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Wafer Burn-In System provides environment (electric annealing-high electric pressure and high heat) poorer than that for actual use for devices which are fabricated out to enhance yield in wafer testing process. For dies lying on the boundary dividing good and no-good dies, the system eliminates the need of testing good dies in the following process or shortens time needed for testing them and enhances productivity and reduces costs by identifying no-good dies in an early stage and eliminating unnecessary works for them. |
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Applicable Area |
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Overseas Sales |
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Product2 |
Product Name |
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MBT (Monitoring Burn-in Test system) |
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Description |
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Monitoring Burn-In Test System is to test package reliability of devices which have passed wafer test. Reliability test is conducted by setting a number of packaged devices in the socket on burn-in board and providing ultimately negative environments (electric signals and heat) for the chamber in MBT system for a certain period of time. APRO3700-FMH of From30 is a multi-flexible system which features not only high-speed D-Ram but also other various functions such as flash memory and compatibility with MCP (Multi Chip Package) to cope with recent market trend and meet the needs of users. |
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Applicable Area |
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Overseas Sales |
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Product3 |
Product Name |
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PROBE UNIT |
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Description |
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ULFP (Ultra Fine Pitch) PROBE UNIT is a nano-precision probe solution developed to test high-density tiny patterns (minimum of 20§ Pitch) of FPD (flat panel display) panels and IC circuit boards. This FPD inspection device identifies inferiority in LCD panels by sending reflection signals and electricity. Unlike existing devices, it is a product of multi-engineering combined with MEMS technology. ULFP PROBE UNIT is a product of MEMS and related design and assembly technology while other probe units depend on manual production. Since a large quantity of it can be produced in a short time, it contributes to shortening the lead time in manufacturing LCD panels. It proudly features upgraded precision and extended utility since it can respond to up to 20§while other existing probe units 60§. Having undergone utility evaluation of panel IZO, the extensibility of this product is guaranteed. |
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Applicable Area |
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Overseas Sales |
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MAJOR PARTNER
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