|
|
| Company |
Simmtech Co., Ltd. |
| CEO |
Se ho, Chun |
YEAR
OF FOUNDATION |
1987 |
No. OF
EMPLOYEE |
1,276 |
| Homepage |
www.simmtech.net/index.html |
| Address |
Star Building 25th floor, Yeoksam-Dong, Kangnam-gu, Seoul, Korea |
| Listed |
KOSDAQ |
CONTACT
Person |
| Name |
|
|
|
E-Mail |
|
overseas_sales@simmtech.co.kr |
|
| Dept |
|
Overseas sales |
|
Tel |
|
82-43-269-9000 |
|
| Title |
|
|
|
Fax |
|
82-02- 3218-6199 |
|
FINANCIAL
STATUS(2005) |
| Capital(US$) |
|
Sales Revenue(US$) |
|
Exporting Amount(US$) |
|
| 13,600,000 |
|
229,161,000 |
|
|
|
FINANCIAL
STATUS(2006) |
| Capital(US$) |
|
Sales Revenue(US$) |
|
Exporting Amount(US$) |
|
| 13,600,000 |
|
29,311,000 |
|
|
|
| Main Business Field |
IT |
Main
Products |
Product1 |
| Product Name |
|
Memory Module |
|
| Description |
|
Memory module PCBs are used for enabling expanded memory support to PCs or workstations by installing multiple DRAMs on a single PCB. There are three popular types of memory module PCBs: the Single Inline Memory Module (SIMM), the Dual Inline Memory Module (DIMM) and the Rambus Inline Memory Module (RIMM). |
|
| Applicable Area |
|
Rambus 144MB (4D), Rambus 144MB (8D), Rambus 144MB (16D), Rambus 256MB (2D), Rambus 256MB (4D), Rambus 288MB (8D), C-RIMM(Continuity-RIMM), Halogen Free (RIMM,8L), DDR (14L), DDR (6L-1), DDR (6L-2), PC100MHz, PC133MHz, SODIMM, Flash Memory Card, LCD |
|
| Overseas Sales |
|
|
|
| Product2 |
| Product Name |
|
Package Substrate |
|
| Description |
|
Non-memory package substrates are a new concept in circuit board design and are necessary for integrating semiconductor chips so that the chips can achieve full functionality.Package substrates enable a new type of chip integration that replaces the existing lead-frame integration. This business requires very advanced technology due to the high density level of the semiconductor chips. |
|
| Applicable Area |
|
BGA,CSP,MCM |
|
| Overseas Sales |
|
|
|
| Product3 |
| Product Name |
|
Telecom Board |
|
| Description |
|
The build-up PCB offers high densities at a competitive cost, and also supports the market shift to chip-scale packages (CSP) and ball-grid array (BGA), leading-edge mounting technologies for semiconductor devices. For HDI (high density interconnection) application some special build-up and connectivity techniques have been established that use RCC (resin coated copper) lamination and micro via formation through laser technology. Build up Boards are applied for portable products like cellular phones and camcorders, and for fine-pitch IC packages. |
|
| Applicable Area |
|
Mobile phone, Network Board, Telecom Board, MCM |
|
| Overseas Sales |
|
|
|
MAJOR PARTNER
/CUSTOMER |
|
|
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